Thin Films
by Gerberich, William W.; Gao, Huajian; Sundgren, Jan-Eric; Baker, Shefford P.Format: Hardcover
Pub. Date: 1999-03-01
Publisher(s): Materials Research Society
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Summary
Interest in the mechanical properties of thin films remains high throughout the world, as evidenced by the large international contingent represented in this book. With regard to stresses, techniques for sorting out residual stress and strain states are becoming more varied and sophisticated. Discussions include Raman scattering, nonlinear acoustic responses and back-scattered electron imaging microscopies, as well as the more standard wafer-bending and X-ray techniques. Spectroscopy, indenting and the burgeoning field of nanoprobe imaging for the characterization of mechanical properties of thin films are also highlighted. Topics include: mechanical properties of films and multilayers; fracture and adhesion; nanoindentation of films and surfaces; mechanical property methods and modelling; tribological properties of thin films; properties of polymer films; stress effects in thin films and interconnects; epitaxy and strain relief mechanisms, measurements.
Table of Contents
| Preface | |
| Acknowledgments | |
| Near-Plastic Threshold Indentation and the Residual Stress in Thin Films | p. 3 |
| Structural Transformations During Growth of Epitaxial Fe(001) Thin Films on Cu(001) and Pt(001) | p. 9 |
| Microstructure and Mechanical Properties of Thin Al-Si-Ge Films | p. 21 |
| The Influence of Strengthening Mechanisms on Stress Relaxation in Thin Aluminum Metallization | p. 27 |
| Film Thickness Effect on Tensile Properties and Microstructures of Submicron Aluminum Thin Films on Polyimide | p. 35 |
| Microhardness Study of Cathode-Mounted Amorphous Hydrogenated Boron Carbide | p. 41 |
| Mechanical Properties of CuNi Films | p. 47 |
| Investigation of the Elastic Modulus of Sol-Gel Derived Titania Using Three-Point Bending Tests | p. 53 |
| Plastic Deformation in Thin Copper Films Determined by X-ray Microtensile Tests | p. 59 |
| Growth, Structure, and Mechanical Properties of Pulsed Laser Deposited TiN/TiB[subscript 2] Microlaminates | p. 65 |
| Dependence of Hardness and Stiffness on Density of Ta[subscript 2]O[subscript 5] and TiO[subscript 2] Layers | p. 71 |
| Fracture of Thin Synthetic Diamond Films | p. 79 |
| Effect of In- and Out-of-Plane Stresses During Indentation of Diamond Films on Metal Substrates | p. 85 |
| A Model of Cleavage Fracture along Metal/Ceramic Interfaces | p. 91 |
| Fracture of Thin Tantalum Nitride Films on AlN Substrates | p. 97 |
| Mechanics of Interfacial Crack Propagation in Microscratching | p. 103 |
| Microscratch Analysis of the Adhesion Failure on Oxide Thin Films with Different Thickness | p. 109 |
| Measuring Interfacial Fracture Toughness with the Blister Test | p. 115 |
| Effects of Mechanical Properties of Metal Films on the Adhesion Strength of Cr/Polyimide Interfaces | p. 121 |
| Influence of Cu Deposition Conditions on the Microstructure and Adhesion of Cu/Cr Thin Film to Polyimide Film | p. 127 |
| Peel Strength in the Cu/Cr/Polyimide System | p. 133 |
| Finite Element Studies of the Influence of Pileup on the Analysis of Nanoindentation Data | p. 141 |
| Indenter Geometry Effects on the Measurement of Mechanical Properties by Nanoindentation with Sharp Indenters | p. 147 |
| Dislocation Nucleation and Multiplication During Nanoindentation Testing | p. 153 |
| Nanoindentation Studies of Yield Point Phenomena on Gold Single Crystals | p. 159 |
| Evolution of the Contact Area During an Indentation Process | p. 165 |
| Mechanical Property Data for Coated Systems - The Prospects for Measuring "Coating Only" Properties Using Nanoindentation | p. 171 |
| Probing Silicate/Sapphire Interfaces with AFM and Nanoindentation | p. 177 |
| Stress Reduction in PACVD Amorphous-Diamond Coatings by Boron Addition | p. 183 |
| Inaccuracies in Sneddon's Solution for Elastic Indentation by a Rigid Cone and Their Implications for Nanoindentation Data Analysis | p. 189 |
| The Effect of Ta and N Content on Mechanical Properties of DC Magnetron Sputtered FeN and FeTaN Thin Films | p. 195 |
| Nanoscale Creep and the Role of Defects | p. 201 |
| Nanoindentation of Soft Films on Hard Substrates: The Importance of Pileup | p. 207 |
| Mechanical Properties of CaF[subscript 2] Single Crystal Substrates Determined from Nanoindentation Techniques | p. 213 |
| In Situ TEM Investigation During Thermal Cycling of Thin-Copper Films | p. 221 |
| Micromechanical Tensile Testing | p. 227 |
| Time-Dependent Deformation During Indentation Testing | p. 233 |
| Stress Distribution in Si Under Patterned Thin Film Structures | p. 239 |
| Nonlinear Acoustic Response in Thin Oxide Layers on Fused Silica | p. 245 |
| Young's Modulus and Density of Thin TiO[subscript 2] Films Produced by Different Methods | p. 251 |
| Simultaneous Overall and Local Stress Analysis of Thin Metal Films by Light Scattering and Beam Deflection Measurements | p. 257 |
| Simulation of Mechanical Deformation and Tribology of Nanothin Amorphous Hydrogenated Carbon (a:CH) Films Using Molecular Dynamics | p. 265 |
| Tribology Studies of Organic-Thin Films by Scanning Force Microscopy | p. 269 |
| Hardness and Deformation Mechanisms of Highly Elastic Carbon Nitride Thin Films as Studied by Nanoindentation | p. 275 |
| Effect of Film Thickness and Substrate Surface Treatment on Substrate Deformation: DLC on MgO | p. 281 |
| Hard Amorphous Hydrogenated Carbon Films Deposited from an Expanding Thermal Plasma | p. 287 |
| Tribological Properties of Tetrahedral Carbon Films Deposited by Filtered Cathodic Vacuum Arc Technique | p. 293 |
| Adhesion Study of DLC/Cr/DLC and DLC/Ti/DLC Sandwich Structures on Hardened Steel | p. 299 |
| Tribological Properties of Nitrogen-Implanted and Boron-Implanted Steels | p. 305 |
| Characterization of the Mechanical and Tribological Properties of Sputtered a:SiC Thin Films | p. 311 |
| Thermal Properties of Magnetron Sputtered TiN and TiAlN Thin Films on HSS | p. 317 |
| Copper Grown Diamond Films | p. 323 |
| The Study of Tribological Performance and Surface Film Characterization of Bismuth Dioctyldithiocarbamate | p. 329 |
| In Situ Electron Spectroscopic Identification of Carbon Species Deposited by Laser Ablation | p. 339 |
| Mechanical Properties of Pure Carbon and Carbon-Nitrogen Coatings on Thin Film Head Sliders | p. 345 |
| Viscoelastic Properties of Healthy Human Artery Measured in Saline Solution by AFM-Based Indentation Technique | p. 353 |
| Microindentation Using Strain Rate Sensitivity to Examine Deformation of Polymeric and Metallic Surface Layers | p. 359 |
| Thin Film Polymer Stress Measurement Using Piezoresistive Anisotropically Etched Pressure Sensors | p. 365 |
| Capillary Stress in Microporous Thin Films | p. 373 |
| Measurement of Low-K Polymer/Metal Interfacial Toughness Using 4-Point Bending Method | p. 379 |
| Detection of Similar Elastic Properties Using a Magnetic Force Controlled AFM | p. 385 |
| The Mechanics of a Free-Standing Strained Film/Compliant Substrate System | p. 393 |
| An Analysis of Void Nucleation in Passivated Interconnect Lines Due to Vacancy Condensation and Interface Contamination | p. 405 |
| Finite Element Modeling of Grain Aspect Ratio and Strain Energy Density in a Textured Copper Thin Film | p. 411 |
| Measurements of Stress Evolution During Thin Film Deposition | p. 417 |
| Relationship Between Void and Hillock Formation and Grain Growth in Thin Aluminum Films | p. 423 |
| Analysis of Stresses and Strains in Passivated Metal Lines | p. 429 |
| Processing-Induced Stresses and Curvature in Patterned Lines on Silicon Wafers | p. 435 |
| Isothermal Stress Relaxation in Al, AlCu and AlVPd Films | p. 443 |
| The Effect of the Passivation Material on the Stress and Stress Relaxation Behavior of Narrow Al-Si-Cu Lines | p. 449 |
| Thermal- and Electromigration-Induced Stresses in Passivated Al- and AlSiCu-Interconnects | p. 455 |
| Stress in Sputtered CO[subscript 90]Fe[subscript 10]/Ag GMR Multilayers | p. 461 |
| Reversible Force-Resistivity Behavior of Thin Films of the TTF-TCNQ Family | p. 467 |
| Strain, Structure and Electronic States in MBE Grown (Nb, Ti)O[subscript 2] Mixed Rutile | p. 475 |
| Anisotropic Behaviour of Surface Roughening in Lattice Mismatched Heteroepitaxial Thin Films | p. 487 |
| Calculation of Equilibrium Island Morphologies for Strained Epitaxial Systems | p. 493 |
| Indentation Modulus and Hardness in Heteroepitaxial Al[subscript x]Ga[subscript 1-x]P Films | p. 499 |
| Origins of Residual Stress in Mo and Ta Films: The Role of Impurities, Microstructural Evolution, and Phase Transformations | p. 505 |
| Stress Determination in Thermally Grown Alumina Scales Using Ruby Luminescence | p. 511 |
| Morphological Instability of SiC Film During Carbonization | p. 517 |
| Stress Analysis of Titanium Dioxide Films by Raman Scattering and X-ray Diffraction Methods | p. 523 |
| Effect of Thickness and Annealing on Stress in Tantalum and Tantalum Nitride Thin Film Hard Coatings | p. 529 |
| Author Index | p. 535 |
| Subject Index | p. 539 |
| Table of Contents provided by Blackwell. All Rights Reserved. |
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